Event Date

July 22-24, 2019

Event Location

Osaka, Japan

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Call for Papers
The proceedings will be published in full text in a periodical on Trans Tech Publications Ltd's website at: www.scientific.net via Materials Science Forum-MSF, which will send to be Indexed by all major citation databases such as Ei Compendex (Engineering Village), Scopus, etc.
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Latest News

•  Online Registration is Open
July 20th, 2018

•  Call for speakers!
July 20th, 2018

•  Welcome to the website of AMSE-2019 July 18th, 2018

Important Dates

•  Abstract Submission Start Day July 1st, 2018

•  Earlybird Registration Start Day July 20th, 2018

•  Earlybird Registration Deadline October 31st, 2018

•  Abstract Submission Deadline May 31st, 2019

•  Acceptance Notification Deadline June 10th, 2019





Welcome to AMSE-2019


On behalf of the organizing committee, we are proud to announce that International Congress on Advanced Materials Sciences and Engineering 2019 (AMSE-2019) will be held during July 22-24, 2019 in Osaka, Japan. On this honorable occasion, Organizing Committee invites the participants from all over the world to take part in this splendid event.

With the theme Redefining the Future of Advanced Materials , AMSE-2019 will be comprised of plenary forum, keynote forum, industry summit and 26 breakout sessions covering contemporary hot topics from Artificial Intelligence, Smart materials, Nano materials, Biomaterials, Semiconductor materials, Shape-Memory Materials, Polymer materials, Carbon and graphene , Quantum dot, etc.

Through oral presentations, posters, panel discussion and colorful social activities, it aims to provide a grand platform for the professionals, decision makers and students from the areas of Materials Science, Nanotechnology, Chemistry and Physics to share their research achievement and indulge in interactive discussions and technical program at the event. There will be also a space for companies and institutions to present their technology, service, products, and innovations.

Finally, we hope AMSE-2019 will be a multidisciplinary conference providing 500+ participants internationally a first hand learning channel, as well as the opportunity to establish partnership and explore new business.


Honorary Chairmen


Dr. Masayoshi Tanaka, professor, Kobe Tokiwa University, Japan


Dr. Nigel Brandon, Professor and Dean, Faculty of Engineering, Imperial College London, UK


Dr. Hiroshi Uechi, Professor, Osaka Gakuin University, Japan

Dr. Yoshitake Masuda, Senior Scientist, AIST, Japan

Plenary Speakers



Speech Title: 4D Printing of Composites

Dr. Suong Van Hoa, Fellow of the Canadian Academy of Engineering, Director of Concordia Center for Composites, Canada

Speech Title: The Role of Electrode Microstructure in Fuel Cells and Batteries

Dr. Nigel Brandon, Professor and Dean, Faculty of Engineering, Imperial College London, UK


Speech Title: Irradiation Hardening and Embrittlement in Structural Materials

Dr. Huiling Duan, Chair Professor and Deputy Dean, School of engineering, Peking University, China

Speech Title: Recent Development in Advanced Composite Materials Research
Dr. Alan Kin Tak Lau, Vice-Chancellor and Professor, Swinburne University of Technology, Academician, European Academy of Sciences, Australia
Speech Title: The Art and Application Space in Responsive Polymers and 3,4D Interactive Material Systems Through Additive Soft Microfabrication
Dr. Raymond Oliver, Professor, Northumbria University; Fellow, Royal Academy of Engineering; Fellow, Institution of Chemical Engineers, UK
Title: Poro-Hyperelasticity: The Mechanics of Fluid-Saturated Soft Materials
Dr. A.P.S. Selvadurai, Fellow, The Royal Society of Canada; William Scott Professor and James McGill Professor, Department of Civil Engineering and Applied Mechanics, McGill University, Canada
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